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Crystal placed in the equipment what position is better?


Since the main factor affecting the short-term stability of the crystal oscillator is temperature change, under the consideration of the overall layout of the design, try to avoid the crystal oscillator close to the chassis shell or close to components with large temperature changes such as fans, and should also be away from high-power RF devices such as RF power amplifiers. In the environment of vibration or acceleration changes, the force of the crystal should also be considered to ensure uniform stress distribution and take effective damping measures such as buffering.